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What are the common fault manifestations of iC chips?

Date:2024-09-20 15:00:00

Damage to IC chips (integrated circuit chips) can lead to various malfunctions, depending on the functionality and application of the chip. Here are some common fault manifestations: View >>

What are the basic principles and processes of laser welding for electronic components?

Date:2024-09-20 14:00:00

Laser welding of electronic components is a technique that uses a laser beam as a heat source for welding. This method has high precision and efficiency, and is suitable for soldering small electronic components. The following are the basic principles and processes of laser welding: View >>

Basic Requirements for Component Welding and Guidelines for Distinguishing Welding Direction

Date:2024-09-19 15:00:00

Component soldering is a crucial step in the electronic assembly process, and the correct soldering direction and method can ensure soldering quality and circuit performance. The following are the basic requirements for component soldering and guidelines on how to distinguish soldering directions: View >>

What are the basic principles and applications of ultrasonic non-destructive testing?

Date:2024-09-19 14:00:00

Ultrasonic Testing (UT) is a non-destructive testing method that utilizes the propagation characteristics of ultrasonic waves in materials to detect defects and evaluate material properties. The basic principles and applications are as follows: View >>

What are the ways to measure the quality of diodes with a multimeter?

Date:2024-09-18 15:00:00

Using a multimeter to measure the quality of a diode is a simple and effective method. Here are the specific steps: View >>

What are the definitions and roles of DPA and FA in the reliability testing of electronic components?

Date:2024-09-18 14:00:00

DPA (Design and Process Audit) and FA (Failure Analysis) are two important analysis and testing methods in the reliability testing of electronic components. Their respective definitions and functions are as follows: View >>

The Influence of Low Air Pressure on the Performance of Electronic Components and Related Reliability Testing Methods

Date:2024-09-14 15:00:00

The impact of low air pressure on product performance, especially in reliability testing of electronic components, is an important research area. The following are the effects of low air pressure on the performance of electronic components and related reliability testing methods. View >>

What are the common causes of failure and detection methods for electronic components?

Date:2024-09-14 14:00:00

The failure of electronic components may be caused by various factors, and understanding these reasons and corresponding detection methods is crucial for improving the reliability and performance of products. The following are common causes of failure and detection methods. View >>

What are the technical requirements and related testing standards for welding heat resistance?

Date:2024-09-13 15:00:00

The requirements and testing standards for welding heat resistance technology are important indicators to ensure that materials can withstand high temperatures and heat affected zone stresses during the welding process. Welding heat can cause changes in material properties, therefore corresponding testing and evaluation are required. The following are the technical requirements and related test standards for welding heat resistance. View >>

What are the usage and maintenance methods for cold and hot shock boxes?

Date:2024-09-13 14:00:00

A thermal shock box is a device used to test the performance of materials and products under extreme temperature changes. It can simulate the effects of rapid temperature changes on materials and is widely used in industries such as electronics, aerospace, automotive, plastics, etc. The following are the usage and maintenance methods of the cold and hot shock box. View >>

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