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What are the main precautions for mechanical impact testing of electronic products?

Date:2024-09-05 15:00:00

When conducting mechanical impact testing on electronic products, multiple aspects need to be considered to ensure the effectiveness and safety of the testing. Here are some key considerations: View >>

What are the key steps and corresponding testing methods for quality inspection of IC chips?

Date:2024-09-05 14:00:00

The quality inspection of integrated circuit (IC) chips is a crucial step in ensuring the performance and reliability of electronic products. The following are the key steps and corresponding testing methods for IC chip quality inspection: View >>

Common methods for detecting the quality of IGBT tubes

Date:2024-09-04 14:00:00

Detecting the quality of IGBT (Insulated Gate Bipolar Transistor) transistors is an important step in ensuring the normal operation of power electronic equipment. Here are some commonly used detection methods: View >>

What are the importance and effective methods of X-ray testing for electronic components?

Date:2024-09-04 11:30:00

The X-ray inspection of electronic components plays an important role in modern electronic manufacturing, especially on high-density and high complexity circuit boards. The following is a detailed introduction to its importance and effective methods. View >>

Introduction to the principle and process of reflow soldering

Date:2024-09-03 15:00:00

Reflow soldering is a widely used process for soldering electronic components, especially in surface mount technology (SMT). It is mainly used to solder surface mount components (SMD) onto printed circuit boards (PCBs). The following is an introduction to the principle and process of reflow soldering. View >>

What are the main screening items for imported electronic components?

Date:2024-09-03 14:00:00

The screening of imported components is an important step in ensuring the quality and performance of electronic products. Here are some key screening criteria to help conduct a comprehensive evaluation when selecting imported components: View >>

What are the common hot and cold shock testing items for IGBT chips?

Date:2024-09-02 15:00:00

The thermal shock test of IGBT (Insulated Gate Bipolar Transistor) chips is mainly used to evaluate their reliability and performance under extreme temperature conditions. Here are some common cold and hot shock testing items: View >>

What are the reasons for using X-ray inspection equipment to detect IC chips?

Date:2024-09-02 14:00:00

The main reasons for using X-ray inspection equipment to detect IC chips include the following: View >>

What is the significance of HASS testing? What products are currently applicable?

Date:2024-08-30 11:30:00

HASS (Highly Accelerated Stress Screening) testing is an accelerated aging testing method aimed at quickly identifying potential defects and failure modes in products by applying stress higher than normal working conditions. HASS testing is commonly used for reliability verification of electronic and electrical products to ensure long-term reliability under normal usage conditions. View >>

Common methods and precautions for high and low temperature testing of circuit boards

Date:2024-08-30 11:00:00

The testing of circuit boards in high and low temperature environments is an important step in ensuring their performance and reliability. The following are the methods and precautions for high and low temperature testing of circuit boards. View >>

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