Login | Join Free

Hotline

4008-655-800
行业资讯
The main items and steps of common component screening

Date:2024-08-15 15:00:00

Component screening is an important step in the design and manufacturing process of electronic products. Effective component screening can ensure product performance, reliability, and cost-effectiveness. The following are the main items and steps for component screening: View >>

What are the reasons and purposes for conducting reliability testing on electronic products?

Date:2024-08-15 14:00:00

The reasons and purposes for conducting reliability testing on electronic products mainly include the following aspects: View >>

IC Matters: Application Fields and Failure Factors of IGBT

Date:2024-08-15 11:17:00

Insulated Gate Bipolar Transistor (IGBT) was born around 1980, and its invention was much later than BJT transistor and MOSFET. In this way, this new device naturally combines the advantages of its predecessors. From the equivalent circuit diagram, IGBT is essentially a composite of a MOSFET and a BJT, and also has two characteristics: high input impedance of MOSFET and low conduction voltage drop of BJT. View >>

Reliability testing methods for electronic components

Date:2024-08-14 15:00:00

The reliability testing of electronic components is an important step in ensuring their stable performance and long lifespan in practical applications. Here are some of the main reliability testing methods: View >>

The appearance defect detection plan for electronic products, including detection methods, equipment applications, and implementation steps.

Date:2024-08-14 14:00:00

The detection of appearance defects in electronic products is an important step in ensuring product quality and reliability. The following is a system's appearance defect detection plan, including detection methods, equipment applications, and implementation steps. View >>

Common methods and techniques for detecting virtual soldering in electronic components

Date:2024-08-13 15:00:00

Virtual soldering refers to poor soldering between electronic components and circuit boards, which may result in poor contact, signal interference, or complete failure. Here are some commonly used methods and techniques for detecting virtual soldering: View >>

Detailed explanation of the entire process, preparation work, and testing steps for testing IC chips

Date:2024-08-13 14:00:00

Testing IC chips is an important step in ensuring their performance and reliability. Before conducting the test, sufficient preparation must be made. The following is a detailed explanation of the entire process of testing IC chips, including preparation work and testing steps. View >>

Common types of electronic product aging testing

Date:2024-08-12 15:00:00

Aging testing of electronic products is an important means of evaluating the stability and reliability of product performance over long-term use. The following are several common types of aging tests: View >>

Common methods, types, and causes of electronic component failure analysis

Date:2024-08-12 14:00:00

Electronic component failure analysis is the process of identifying and understanding the causes of electronic component failure in order to take measures to improve product reliability and performance. The following are common methods, types, and causes of electronic component failure analysis: View >>

Common Failure Modes and Causes of Mechanical Components

Date:2024-08-09 15:00:00

There are various forms of failure of mechanical parts, which can usually be classified into the following common types and their causes: View >>

First « 1 2 5 6 7 8 9 155 156 » Last
Baidu
map